尹春燕简介

发布者:田绍鹏发布时间:2020-05-06浏览次数:2275

个 人 简 历

  

基本资料

·姓名:尹春燕

·性别:女

·出生年月:19784

·民族:汉族

·职称: 副教授

·学历:博士

·职务:

·联系电话:待定

·E- mailyincy@seu.edu.cn

个人简历

工作经历:

2019.10-至今, 东南大学,副教授;

2013.09-2019.08,英国格林威治大学,讲师(Lecturer

2007.01-2013.08,英国格林威治大学,研究员(Research Fellow

2001.10-2002.08,香港城市大学,研究助理(Research Assistant

教育经历:

2002.09-2006.10,英国格林威治大学,博士;

1999.09-2001.07,哈尔滨工业大学,硕士;

1995.09-1999.07,哈尔滨工业大学,本科。

【 研究方向

主要研究方向:

  • 高可靠性应用领域电子封装材料、方法及可靠性;

  • 基于失效物理的可靠性分析及建模;

  • 电子系统故障预测和健康管理。

研究成果

发表SCIEI文章30余篇,其中第一作者17篇,受邀在第18届国际电子封装会议(ICEPT)做分会场特邀报告,第2届国际电子系统集成会议(ESTC)分会场主席。


代表性论文:

  1. C.Y. Yin, S. Stoyanov, C. Bailey and P. Stewart, “Thermomechanical Analysis of Conformally Coated QFNs for High-Reliability Applications”, IEEE Transactions on Components, Packaging and Manufacturing, 2019, 9(11): 2210-2218

  2. F. Dinmohammadi, D. Flynn, C. Bailey, M. Pecht, C.Y. Yin, P. Rajaguru and V. Robu, “Predicting Damage and Life Expectancy of Subsea Power Cables in offshore Renewable Energy Applications”, IEEE Access, Vol.7, 2019pp. 54658-54669

  3. K. C. Nwanoro, H. Lu, C.Y. Yin and C. Bailey, “An Analysis of the Reliability and Design Optimization of Aluminum Ribbon Bonds in Power Electronics Modulus using Computer Simulation Method”, Microelectronics Reliability, Vol.87, Issue 2, 2018, pp. 1-14.

  4. C.Y. Yin, C. Best, C. Bailey and S. Stoyanov, “Statistical Analysis of the Impact of Refinishing Process on Leaded Components”, Microelectronics Reliability, 2015, 55: 424-431

  5. M. Musallam, C.Y. Yin, C. Bailey and C.M. Johnson, “Mission Profile-Based Reliability Design and Real-Time Life Consumption Estimation in Power Electronics”, IEEE Transactions on Power Electronics, 2015, 30(5): 2601-2613

  6. M. Musallam, C.Y. Yin, C. Bailey, C.M. Johnson, “Application of Coupled Electro-thermal and Physics-of-failure-based Analysis to the Design of Accelerated Life Tests for Power Modules”, Microelectronics Reliability, 2014, 54: 172-181

  7. C.Y. Yin, H. Lu, M. Musallam, C. Bailey and C.M. Johnson, “Prognostic Reliability Analysis of Power Electronics Modules” International Journal of Performability Engineering, 2010, 6: 513-524

  8. H. Lu, C. Bailey, C.Y. Yin, “Design for Reliability of Power Electronics Modules”Microelectronics Reliability, 2009, 49: 1250-1255

  9. C.Y. Yin, H. Lu, C. Bailey and Y.C. Chan, “Macro-Micro Modelling Analysis for an ACF Flip Chip”, Soldering & Surface Mount Technology, 2006, 18(2): 27-32

  10. C.Y. Yin, H. Lu, C. Bailey and Y.C. Chan, “The Effect of Reflow Process on the Contact Resistance and Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications”, Microelectronics Reliability, 2003, 43: 625-633