主持和参与的研究课题涉及航天、国防、生物医疗和光学器件等广泛领域；以通讯/第一作者身份发表SCI和EI论文30余篇；主要研究成果包括：
1.“洞察号”火星探测MEMS传感器核心设计与制造者，其参与研发的10ng/√Hz超低噪音密度和2500g超高抗冲击强度MEMS重力梯度传感器于2018年11月26日成功登陆火星，首次实现了人类对火星内核运动状态的实时监测，为揭示类地球行星的起源与演化提供了有效研究方法；
2.基于热超声和各向异性导电胶的倒装电子芯片封装原理，创新性地提出了填胶热超声倒装电子器件封装方法，解决了长期困扰高密度、细间距晶圆级倒装集成电路电子芯片封装领域无法解决的可靠性难题；
3.自主研发一台高精度倒装微电子芯片封装制造设备，获得了国际知名公司PragmatIC，Printed Electronics Ltd和Signify的认可，首次实现了铝基柔性电子、塑料电子芯片和高密度硅基电子芯片的低温超声封装制造过程，为塑料混合电子系统的集成制造提供了创新方法。
代表性论文：
[1] G. Dou, A. S. Holmes, System Integration for Plastic Electronics Using Room Temperature Ultrasonic Welding, Advanced Engineering Materials, 2020, p.101002
[2] X. Song, Q. Wang, H. Liu, G. Dou, et al., A method for alleviating the effect of pinhole defects in inter-metal dielectric films, J. Micromech. Microeng. Vol.29, 2019, p.015012
[3] H. Liu, W. T. Pike, G. Dou, A seesaw-lever force-balancing suspension design for space and terrestrial gravity-gradient sensing, Journal of Applied Physics, Vol.119, 2016, p.124508
[4] G. Dou, A. S. Holmes, et al, Transfer of Functional Ceramic Thin Films Using a Thermal Release Process, Advanced Materials, Vol.23 (10), 2011, pp.1252-125
[5] G. Dou, D. C. Whalley, C. Liu, Mechanical Characterization of Individual Ni/Au Coated Microsize Polymer Particles, Applied Physics Letters, Vol.12, 2008, pp.104018
[6] B. Li, C. Wang, G. Dou, Synthesis of Multiferroic Bi0.9La0.1Fe0.95Mn0.05O3/ Ba0.7Sr0.3TiO3/Ni0.8Zn0.2Fe2O4 Nanotubes with One Closed End Using a Template-assisted Sol–gel Process, CrystEngComm, Vol.15(11), 2013, p.2147-2156、
[7] B. Li, C. Wang, G. Dou, et al., Effects of Ba0.7Sr0.3TiO3-based buffer layers and La/Mn doping on the crystallization behavior and multiferroic properties of Bi, RSC Advances, Vol.4(99), 2014, p.101039
[8] W. Liu, C. Wang and G. Dou, et al., Laser-induced actuation of individual microsize liquid metal droplets on an open solid surface, Applied Physics Express, Vol.10 (1), 2017, p.017202
[9] G. Dou, Y. C. Chan, et al., Electrical Conduction Characteristics of Anisotropic Conductive Adhesive Particles, ASME, Journal of Electronic Packaging, Vol.125(4), 2003, pp.609-616
[10] G. Dou, D. C. Whalley, C. Liu, An Experimental Methodology for the Study of Co- planarity Variation Effects in Anisotropic Conductive Adhesive Assemblies, Soldering & Surface Mount Technology, Vol.22(1), 2010, pp.47-55
