本科生课程《高频集成电路》

硕士研究生课程《集成电路分析与设计》

硕士研究生课程《VLSI测试》

（1）基于RF MEMS技术的微波通讯信号的功率、相位和频率的单片集成检测系统；

（2）硅基微波和毫米波集成电路；

（3）单片集成微型能量收集器及其电源管理电路。

近15年来，负责完成和正在主持国家自然科学基金共5项、国家863计划1项和部级等纵向研究项目6项，以第一发明人获国家发明专利授权50多项；以通讯作者，指导研究生在IEEE TED\EDL\JMEMS\SENSORS和JMM\SENSORS AND ACTUATORS A-PHYSICAL等国际权威专业期刊发表了被SCI收录学术论文80多篇，在本专业的重要国际学术会议上发表了被ISTP收录学术论文20多篇，出版专著1部（廖小平、张志强、易真翔、闫浩《微电子机械微波通讯信号检测集成系统》科学出版社 2016）。

发表在IEEE的代表性论文：

[1] Sen  Zhang, Xiaoping Liao*，A C-Band MEMS Frequency Discriminator With  High Sensitivity and Linearity，IEEE Electron Device Letters,  42(3): 410-413, 2021.

[2] Jian-Hua  Li, Xiaoping Liao*, Chenlei Chu，Electromagnetic-Thermal-Electric  Analysis of Indirectly-Heated RF MEMS Power Sensors With Different Terminal  Resistor Dimensions，IEEE Sensors Journal, 21(4): 4342-4349,  2021.

[3] Jian-Hua Li, Xiaoping Liao*,  Chenlei Chu，A Novel Thermistor-Based RF Power Sensor With Wheatstone Bridge  Fabricating on MEMS Membrane，IEEE Journal of Microelectromechanical Systems,  29(5): 1314-1321, 2020.

[4] Sen Zhang, Xiaoping Liao*，Investigations of the Thermoelectric-Photoelectric  Integrated Power Generator With I-Shaped Thermocouple Structure and its Test  Structures，IEEE Sensors Journal, 19(23): 11113-11119, 2019. 

[5] Jiabin Yan, Xiaoping Liao*, Sichao Ji，Sen Zhang，A Novel Multi-Source Micro Power Generator for Harvesting Thermal and Optical Energy，IEEE Electron Device Letters, 40(2):349-352, 2019.

[6] Jiabin Yan, Xiaoping Liao*, Sichao Ji，Sen Zhang，MEMS-Based Thermoelectric–Photoelectric Integrated Power Generator，IEEE Journal of Microelectromechanical Systems, 28(1):1-3, 2019.

[7] Chenlei Chu, Xiaoping Liao*, Chenglin Li，Chen Chen, A Micro-Machined Phase Discriminator With Improved Power Capacity on C-Band and X-Band, IEEE Sensors Journal, 19(6):2133-2139, 2019. 

[8] Hao Yan, Xiaoping Liao*, Chen Chen, Chenglin Li, High-Power Handling Analysis of a Capacitive MEMS Power Sensor at X-Band, IEEE Sensors Journal, 18(13): 5272-5277, 2018.

[9] Jiabin Yan, Xiaoping Liao*, Deyang Yan, and Youguo Chen. Review of micro thermoelectric generator，IEEE Journal of Microelectromechanical Systems, 27(1):1-18, 2018.

[10]Hao Yan, Xiaoping Liao*, Chenglin Li, A Dual-Channel MEMS Amplitude Demodulator for On-Line Detection in Radio Relay Station, IEEE Electron Device Letters，38(8)：1121-1124，2017.

[11] Chenlei Chu, Xiaoping Liao*, Improved Dynamic Range of Microwave Power Sensor by MEMS Cantilever Beam, IEEE Journal of Microelectromechanical Systems, 6(6):1183-1185, 2017.

[12] Hao Yan, Xiaoping Liao*, An X-Band Dual Channel Microwave Phase Detector Based on GaAs MMIC Technology, IEEE Sensors Journal, 16(17): 6515-6516, 2016.

[13] Juzheng Han, Xiaoping Liao*, A Compact Broadband Microwave Phase Detector Based on MEMS Technology, IEEE Sensors Journal, 16(10): 3480-3481, 2016.

[14] Yan, Jiabin, Xiaoping Liao*, Research on the Response Time of Indirect-Heating Microwave Power Sensor, IEEE Sensors Journal, 16(13): 5270-5276, 2016.

[15] Hao Yan, Xiaoping Liao*, The High Power up to 1 W Characteristics of the Capacitive Microwave Power Sensor With Grounded MEMS Beam, IEEE Sensors Journal, 15(12): 6765-6766, 2015.

[16] Juzheng Han, Xiaoping Liao*, Third-Order Intermodulation of an MEMS Clamped–Clamped Beam Capacitive Power Sensor Based on GaAs Technology, IEEE Sensors Journal, 15(7): 3645-3646, 2015.

[17]Zhenxiang Yi， Xiaoping Liao*, Measurements on Intermodulation Distortion of Capacitive Power Sensor Based on MEMS Cantilever Beam, IEEE Sensors Journal, 14(3): 621-622, 2014.

[18] Zhenxiang Yi, Xiaoping Liao*, Hao Yan, A Frequency-Compensation-Type Microwave Power Sensor Fabricated by GaAs MMIC Process, IEEE Sensors Journal, 14(9):2936-2937, 2014.

[19]Zhiqiang Zhang，Xiaoping Liao*,Micromachined passive bandpass filters based on GaAs Monolithic-Microwave-Integrated-Circuit technology, IEEE Transactions on Electron Devices, 60(1), 221–228, 2013.

[20] Debo Wang, Xiaoping Liao*, and Tong Liu, Optimization of indirectly-heated type microwave power sensors based on GaAs micromachining, IEEE Sensors Journal, 12(5):1349-1355, 2012.

[21] Debo Wang, Xiaoping Liao*, and Tong Liu, A novel thermoelectric and capacitive power sensor with improved dynamic range based on GaAs MMIC technology, IEEE Electron Device Letters, 33(2): 269-271, 2012.

[22] Zhiqiang Zhang and Xiaoping Liao*, A thermocouple-based self-heating RF power sensor with GaAs MMIC-compatible micromachining technology, IEEE Electron Device Letters, 33(4): 606-608, 2012.

[23] Debo Wang, Xiaoping Liao*, and Tong Liu, A thermoelectric power sensor and its package based on MEMS technology，IEEE Journal of Microelectromechanical Systems, 21(1): 121-131, 2012.

[24] Zhiqiang Zhang, Xiaoping Liao*, Packaging-test-fixture for in-line coupling RF MEMS power sensors, IEEE Journal of Microelectromechanical Systems, 20(6): 1231-1233, 2011. 

2015年入选江苏省六大人才高峰计划。

现有博士生5人和硕士生3人，并将继续招收有志于（1）基于RF MEMS技术的微波通讯信号的功率、相位和频率的单片集成检测系统；（2）硅基微波和毫米波集成电路；（3）单片集成微型能量收集器及其电源管理电路的设计理论和实现方法研究的硕士研究生和博士研究生。