研究成果被成功应用于航天和民用领域。获国家技术发明二等奖、多项国际会议论文奖(通讯作者)和江苏省科技进步奖。获60余项发明专利授权(包括3项美国专利授权)，在IEEE TCPMT、IEEE ECTC等国际主流期刊和会议上发表论文100余篇。与江阴长电、华进半导体联合培养工程博士和硕士生。在02专项以及企业项目资助下，与江阴长电、中科院微电子所、航天13所等多个单位合作，开展了铜柱凸点、LED封装、基于垂直生长碳纳米管阵列热界面材料、硅/玻璃复合基板技术和先进传感器封装技术等研究。部分论著和专利如下：
1.Yu Ji, Jintang Shang, Guoliang Li, Jin Zhang, Jianfeng Zhang. Microfabricated Shaped Rubidium Vapor Cell for Miniaturized Atomic Magnetometers. IEEE Sensors Letters,4(2),1-4:2020
2.Ji, Yu, Shang Jintang, Zhang Jin, Micro-printing of patterned diamond-like carbon coatings on glass by anodic bonding, Electronics Letters,55(8),483-484:2019
3.Luo Bin, Shang Jintang, Su, Zhaoxi, Zhang Jianfeng, Wong Ching-Ping, Height Adjustment of 3-D Axisymmetric Microumbrella Shells for Tailoring Wineglass Frequency, IEEE Transactions on Components, Packaging and Manufacturing Technology,9(3),567-574:2019
4.Yu Ji, Jintang Shang, Jin Zhang, Guoliang Li. Magnetic Gradient Measurement Using Micro-Fabricated Shaped Rubidium Vapor Cell. IEEE Transactions on Magnetics, 55(9):2019
5.Luo B, Shang J, Su Z, et al. Height adjustment of 3-D axisymmetric microumbrella shells for tailoring wineglass frequency [J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 9(3): 567-574
6.Luo B, Ma M, Zhang M, et al. Composite glass-silicon substrates embedded with microcomponents for MEMS system integration [J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 9(2): 201-208
7.Ji, Yu, Shang Jintan, Zhang Jin, Micro-printing of patterned diamond-like carbon coatings on glass by anodic bonding, Electronics Letters,55(8),483-484:2019
8.Yu Ji, Jintang Shang, Qi Gan, Lei Wu, C.P. Wong, Improvement of Sensitivity by Using Micro-fabricated Spherical Alkali Vapor Cells for Chip-scale Atomic Magnetometers, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018, 8(10):1715-1722
9.Lei Wu, Jintang Shang, Yu Ji , Qi Gan, and Ching-Ping Wong, Influence of Buffer-Gas Pressure Inside Micro Alkali Vapor Cells on the Performance of Chip-Scale SERF Magnetometers, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018, 8(4):621-625
10.Qi Gan, Jintang Shang, Yu Ji, and Lei Wu, Simultaneous excitation of 85Rb and 87Rb isotopes inside a microfabricated vapor cell with double-RF fields for a chip-scale MZ magnetometer, Review of Scientific Instruments, 2017, 88(11): 115009
11.Kangni Liu, Jintang Shang, Jin Zhang, Xiang Yue, Chen Ye, Jianfeng Zhang, Ching-Ping Wong, Microfabricated SERF Atomic Magnetometers for Measurement of Weak Magnetic field, 2020 IEEE 70th Electronic Components and Technology Conference(ECTC),2020,pp.991-996
12.Ji Y, Gan Q, Wu L, Shang J, Geometry influence of the micro alkali vapor cell on the sensitivity of the chip-scale atomic magnetometers, Micro Electro Mechanical Systems (MEMS), 2017 IEEE 30th International Conference on. IEEE, 2017: 342-345
13.Bin Luo, Jintang Shang, Yuzhen Zhang, Hemispherical glass shell resonators fabricated using Chemical Foaming Process, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp. 2217-2221
14.Mengying Ma, Jintang Shang, Bin Luo, Preparation of wafer level glass-embedded high-aspect-ratio passives using a glass reflow process. 28th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2015), 2015, pp. 427-430
15.Jintang Shang, Boyin Chen, Wei Lin, Ching-Ping Wong, Di Zhang, Chao Xu, Junwen Liu and Qin-An Huang. Preparation of Wafer-level Glass Cavities by a Low-cost Chemical Foaming Process(CFP). Lab on a chip, 2011, 11 (8):1532 – 1540.
16.Shang J, Ma M. Wafer-level manufacturing method for embedding passive element in glass substrate: U.S. Patent 10,321,577 [P]. 2019-1-11
17.Shang J. Foaming process for preparing wafer-level glass micro-cavities: U.S. Patent 8,887,527 [P]. 2014-11-18
18.Shang J, Luo B. Micro three-dimensional shell resonator gyroscope: U.S. Patent 10,527,422 [P]. 2020-1-7
