- 2016 - 2020：美国德克萨斯理工大学 （Texas Tech University），计算机科学（博士）

- 2014 - 2016：美国德克萨斯理工大学 （Texas Tech University），计算机科学（硕士）

• 2024.4 - 至今：  东南大学，集成电路学院，副教授

• 2024.1 - 2024.4：国家集成电路自动化设计技术创新中心，大模型项目组，项目主管

• 2023.6 - 2024.1：清华大学，深圳国际研究生院，项目研究员

• 2021.5 - 2023.5：清华大学，深圳国际研究生院，博士后研究员

• 2018.5 - 2018.8：美国西北太平洋国家实验室（Pacific Northwest National Laboratory），High-Performance Computing Department，博士实习（Ph.D. Intern）

• 2017.5 - 2017.8：美国阿贡国家实验室（Argonne National Laboratory），Mathematics and Computer Science Division ，科研助理（Research Aide）

• 2016.5 - 2016.8：美光科技（MicronTechnology, Inc.），Advanced Memory System Group，编译器工程师（Compiler Engineer）

研究专注于计算机体系结构，新一代EDA工具，处理器设计，大语言模型，高性能计算，并行计算，编译器，二进制转译，敏捷开发工具链等方向。

近5年发表论文（ * 通讯作者）

• Ke Xu, Jialin Sun, Yuchen Hu, Xinwei Fang, Weiwei Shan, Xi Wang* and Zhe Jiang, MEIC: Re-thinking RTL Debug Automation using LLMs, IEEE ICCAD 2024.

• Xi Wang, Gwok-Waa Wan, Sam-Zaak Wong, Layton Zhang, Tianyang Liu, Qi Tian and Jianmin Ye, ChatCPU: An Agile CPU Design & Verification Platform with LLM, IEEE DAC, Best Paper Award Nominee (5/1456),  2024

• Gwok-Waa Wan, Sam-Zaak Wong, Xi Wang*, Jailbreaking Pre-trained Large Language Models Towards Hardware Vulnerability Insertion Ability, ACM/IEEE GLVLSI 2024.

• Tianyang Liu, Qi Tian, Jianmin Ye, LikTung Fu, Shengchu Su, Junyan Li, Gwok-Waa Wan, Layton Zhang, Sam-Zaak Wong, Xi Wang*, and Jun Yang，ChatChisel: Enabling Agile Hardware Design with Large Language Models，ISEDA 2024.

• Yuxuan Du, Zhengguo Shen, Junyi Qian, Chengjun Wu, Weiwei Shan, and Xi Wang*, DSC-TRCP: Dynamically Self-calibrating Tunable Replica Critical Paths Based Timing Monitoring for Variation Resilient Circuits, IEEE JSSC, 2024. 

• Cai Li, Haochang Zhi, Kaiyue Yang, Junyi Qian, Zhihao Yan, Lixuan Zhu, Chao Chen, Weiwei Shan, and Xi Wang*, A 0.61μW Fully-Integrated Keyword-Spotting ASIC with Real-Point Serial FFT-Based MFCC and Temporal Depthwise Separable CNN, IEEE JSSC, 2023.

• Xi Wang, John D. Leidel, Brody Williams, Alan Ehret, Miguel Mark, Michel Kinsy, and Yong Chen, xBGAS: A Global Address Space Extension on RISC-V for High Performance Computing, IEEE Conference on International Parallel & Distributed Processing Symposium (IPDPS), Best Paper Award (1/462), 2021. 

• Xi Wang*, Antonino Tumeo, John D. Leidel, Jie Li and Yong Chen, HAM: Hotspot-Aware Manager for Improving Communications with 3D-Stacked Memory, IEEE Transactions on Computers (TC). 

• Zach Hansen, Brody Williams, John D. Leidel, Xi Wang, Yong Chen, DMM-GAPBS: Adapting the GAP Benchmark Suite to a Distributed Memory Model, IEEE High Performance Extreme Computing Conference (HPEC), 2021.

• Brody Williams, John D. Leidel, Xi Wang, and Yong Chen, CircusTent: A Benchmark Suite for Atomic Memory Operations, ACM International Symposium on Memory Systems (MEMSYS), 2020.

• John D. Leidel, Xi Wang*, Brody Williams, and Yong Chen, Toward a Microarchitecture for Efficient Execution of Irregular Applications, ACM Transactions on Parallel Computing (TOPC), 2020. 

• Xi Wang, John D. Leidel, Brody Williams, and Yong Chen, PAC: Paged Adaptive Coalescer for 3D-stacked memory, ACM High-Performance Parallel and Distributed Computing (HPDC), 2020. 

• Xi Wang, Brody Williams, John Leidel, et al., Remote Atomic Extension (RAE) for Scalable High Performance Computing. IEEE Design Automation Conference (DAC), 2020. 

• Xi Wang, Antonino Tumeo, John D. Leidel, Jie Li, and Yong Chen, MAC: Memory Access Coalescer for 3D-Stacked Memory, ACM International Conference on Parallel Processing (ICPP), 2019.

• Jie Li, Xi Wang, Antonino Tumeo, Brody Williams, John D. Leidel, and Yong Chen, PIMS: A Lightweight Processing-in-Memory Accelerator for Stencil Computations, ACM International Symposium on Memory Systems (MEMSYS), 2019.

• Xi Wang, John D. Leidel, Yong Chen, Memory Coalescing for Hybrid Memory Cube, ACM International Conference on Parallel Processing (ICPP), 2018.

• IEEE DAC 2024 Best Paper Award Nominee (5/1456)

• IEEE VLSI 2024 “Code-a-Chip” Award, First Prize

• CSAW 2023 International AI Hardware Attack Challenge, First Prize

• IEEE ISSCC 2023 “Code-a-Chip” Award, First Prize

• IEEE Conference on IPDPS 2021 Best Paper Award (1/462)

• Best Research Poster Award of NSF CAC (Cloud and Autonomic Computing) in 2020

• Helen DeVitt Jones Excellence in Graduate Teaching Award of Texas Tech University in 2018

• Travel Grant for attending ACM/IEEE SC17 (Super Computing 2017) in Denver 2017

• Travel Grant for attending ACM/IEEE SC16 (Super Computing 2016) in Salt Lake City 2016

我们的团队名称为GEAR（ Group of Emerging Architecture Research），专注于计算机体系结构和EDA方向的前沿探索，致力于推动全球新一代EDA技术的发展，应对如今领域定制架构设计和日益繁复的系统设计挑战，以软硬协同的方式开展端到端的全栈式芯片设计研究。

Every cog in the GEAR counts! & There is no loser in a winning team! 我们关注每一位团队成员的未来发展，以Top-Down的教育方式辅助全栈式的芯片设计流程学习，鼓励以兴趣为导向的开放研究模式。同时，我们也根据团队成员们的个人发展规划，平衡科研探索（Research）和工程实现（Development），致力于培养IC行业的六边形战士。

课题组常年招收博士/硕士研究生及本科生，欢迎对计算机体系结构、RISC-V开源架构、CPU设计、EDA工具链、大语言模型、人工智能、私密计算、编译器、高性能计算、二进制转换、和并行计算等方向感兴趣的同学加入，详情请通过邮件沟通咨询（xi.wang@seu.edu.cn）。